TSMC 4nm Process | 3nm Process
TSMC, a leading foundry, at Company’s 2021 Technology Symposium announced that 4nm process technology is expected to start trial production in the third quarter of 2021, one quarter earlier than previously planned, while the 3nm process will be mass-produced in the second half of 2022 as planned.
The N4 (4nm) enhancement to the 5nm family further improves performance, power efficiency, and transistor density along with the reduction of mask layers and close compatibility in design rules with N5. TSMC N4 development has proceeded smoothly since its announcement at the 2020 Technology Symposium, with risk production set for the third quarter of 2021.
TSMC’s N3 (3nm) technology is poised to be the world’s most advanced technology when it begins volume production in the second half of 2022. Relying on the proven FinFET transistor architecture for the best performance, power efficiency, and cost-effectiveness, N3 will offer up to 15% speed gain or consume up to 30% less power than N5, and provide up to 70% logic density gain.
said TSMC.
This is the second consecutive year that TSMC held an online technology forum to share with customers TSMC’s latest technology developments, including the N6RF process to support the next generation of 5G smartphones and WiFi 6/6E performance, the N5A process to support the most advanced automotive applications, and the enhanced version of the 3DFabric family of technologies.
