Snapdragon 8 Gen4 – TSMC-Samsung Dual Foundry Model
In a significant development poised to reshape the semiconductor landscape, Qualcomm’s forthcoming 3nm chip has set the stage for an unprecedented collaboration between three major tech powerhouses. While the chip’s launch is on the horizon, the intricate web of partnerships, involving Qualcomm, TSMC, and Samsung, is already in motion.
Qualcomm, a prominent player in the chip design and manufacturing sector, has traditionally aligned itself with TSMC. However, the allure of a more potent and efficient 3nm manufacturing process has compelled Qualcomm to expand its horizons. Reports indicate that Qualcomm will be working closely with both TSMC and Samsung to bring its ambitious 3nm chip to fruition.
This alliance is particularly intriguing given Qualcomm’s past exclusive partnership with TSMC. While the collaboration with Samsung was once severed, the imminent 3nm chip appears to herald a new era of cooperation between these giants. A significant catalyst for this shift was Samsung’s 4nm manufacturing process, which couldn’t meet Qualcomm’s exacting specifications. Consequently, the Snapdragon 8+ Gen1 and Gen2 processors opted for TSMC’s 4nm process, signaling a decisive pivot in the manufacturing landscape.
Although TSMC stands poised to embrace the 3nm era, it’s worth noting that a significant chunk of its production capacity has already been allocated to Apple. Consequently, Qualcomm’s Snapdragon 8 Gen3 has adhered to the TSMC’s 4nm process in a bid to optimize manufacturing costs.
Renowned analyst Ming-Chi Kuo added fuel to the fire by revealing that Qualcomm’s highly anticipated Snapdragon 8 Gen4 would indeed leverage the groundbreaking 3nm process. While the price tag of TSMC’s 3nm process raised concerns amidst declining smartphone demand, Qualcomm is seemingly exploring a novel “TSMC-Samsung dual foundry model” to navigate these challenges.
Unveiling more details, the TSMC iteration of the Snapdragon 8 Gen4 will harness the prowess of the N3E process, featuring the FinFET architecture. On the other hand, the Samsung version of the Snapdragon 8 Gen4 will harness the power of the 3nm GAA process, showcasing a dual approach to innovation.
Insiders also shed light on the allocation of responsibilities within this intricate collaboration. TSMC, armed with its readiness for the 3nm process, will primarily oversee the production of the Qualcomm Snapdragon 8 Gen4 processor. Meanwhile, Samsung will take the reins for the production of the “Qualcomm Snapdragon 8 Gen4 for Galaxy” processor, cementing their role in this groundbreaking project.
In conclusion, the development of Qualcomm’s 3nm chip has set off a cascade of strategic collaborations between industry giants TSMC, Samsung, and Qualcomm itself. This novel approach to chip manufacturing showcases the dynamic nature of the tech landscape and the relentless pursuit of innovation. As the launch of the Snapdragon 8 Gen4 looms, the implications of this alliance hold the promise of shaping the future of semiconductor technology.
