Exynos 2400 Features FOWLP Process
In the fast-paced world of smartphones, Samsung is gearing up for a groundbreaking release with the Galaxy S24 Series, slated to hit the market in the first month of the upcoming year. A notable shift is anticipated with Samsung’s renewed confidence in its Exynos chipset, specifically the introduction of the Exynos 2400 to the Galaxy S24 standard version and Galaxy S24 Plus in selected regions.
The Korean media outlet EDaily recently shed light on a significant technological leap in the Exynos 2400 – the adoption of Fan-out Wafer-level Packaging (FOWLP). Samsung has successfully validated the FOWLP process, marking a pivotal moment in semiconductor chip packaging. The Exynos 2400 mobile platform will be the pioneer in utilizing this cutting-edge packaging process in the Galaxy S24 and Galaxy S24 Plus.
FOWLP is hailed as a key technology that enhances semiconductor chip performance, positioning Samsung as a formidable contender against industry leaders like TSMC. Unlike traditional chip packaging methods that involve connecting chips to a Printed Circuit Board (PCB), FOWLP eliminates the need for a PCB. This direct connection to the wafer results in a 40% reduction in chip size, a 30% decrease in thickness, and a remarkable 15% boost in performance compared to the prevalent FC-BGA (Flip Chip-Ball Grid Array) technology.
As the tech community eagerly anticipates the Galaxy S24 Series launch, Samsung’s strategic integration of FOWLP technology and the powerhouse Exynos 2400 chipset adds layers of innovation to the smartphone landscape. Will Samsung finally surpass the Snapdragon 8 series this time? Only time will unveil the answers, and enthusiasts are urged to stay tuned for what promises to be a game-changing release in the world of smartphones.