MediaTek Tapped Out First-Ever 3nm Chip
In a groundbreaking announcement, MediaTek and TSMC have unveiled their successful collaboration in developing MediaTek first-ever 3nm chip utilizing TSMC’s cutting-edge technology. This partnership is a significant milestone in the longstanding relationship between these two tech giants, promising to revolutionize the world of semiconductor manufacturing.
MediaTek, a global leader in semiconductor solutions, is set to introduce its flagship Dimensity system-on-chip (SoC) with mass production scheduled for the upcoming year. This venture underscores the companies’ commitment to leveraging their respective strengths in chip design and manufacturing to jointly create flagship SoCs with superior performance and power efficiency, ultimately enhancing the user experience across a wide range of global devices.
Joe Chen, President of MediaTek, expressed their dedication to using cutting-edge technology to create products that positively impact our lives. TSMC’s unwavering commitment to high-quality manufacturing enables MediaTek to showcase its superior chip design, delivering high-performance and quality solutions to customers worldwide, particularly in the competitive flagship market.
Dr. Cliff Hou, Senior Vice President of Europe and Asia Sales at TSMC, emphasized that this collaboration extends the reach of advanced semiconductor process technology, making it accessible to everyday devices like smartphones. The partnership between MediaTek and TSMC has yielded numerous innovations over the years, and they are excited to continue pushing boundaries into the 3nm generation and beyond.
TSMC’s 3nm process technology is at the heart of this achievement, offering significant improvements in performance, power efficiency, and yield compared to their previous N5 process. With TSMC’s 3nm technology, the Dimensity SoCs developed by MediaTek can achieve up to an 18% speed improvement at the same power consumption or a 32% reduction in power consumption at the same speed. Additionally, this technology enables a remarkable 60% increase in logic density, paving the way for more powerful and efficient devices.
MediaTek’s Dimensity SoCs, crafted using this cutting-edge process technology, are designed to meet the ever-growing demands of modern users. These SoCs are tailored to excel in mobile computing, high-speed connectivity, artificial intelligence, and multimedia, ensuring a seamless and immersive user experience.
The first flagship chipset to harness the power of TSMC’s 3nm process is expected to be named Dimensity 9400 and is slated for release in the second half of 2024. It will empower a wide range of devices, including smartphones, tablets, intelligent cars, and more, setting new standards for performance and efficiency in the tech industry.