MediaTek Unveils Dimensity 8300 5G
In a significant move, MediaTek has officially launched its Dimensity 8300 5G generative AI mobile chip, introducing flagship features to the Dimensity 8000 series. Dr. Robin Lee, Vice President of MediaTek’s Wireless Communications Division, emphasized the series’ commitment to providing a premium user experience. The Dimensity 8300 boasts energy-efficient On-device AI capabilities, supports flagship storage, and promises an enhanced gaming, imaging, and multimedia experience.
Powerful Performance and Efficiency:
Built on TSMC’s second-generation 4nm process and the Armv9 CPU architecture, the Dimensity 8300 flaunts an octa-core CPU with four Cortex-A715 performance cores and four Cortex-A510 energy-efficient cores. This configuration results in a remarkable 20% boost in peak CPU performance compared to its predecessor, coupled with a notable 30% reduction in power consumption.
- CPU:
- 1 × 3.35GHz Cortex A715
- 3 × 3.2GHz Cortex A715
- 4 × 2.2GHz Cortex A510
The graphics department sees a significant upgrade with the integration of a 6-core Mali-G615 GPU (1400MHz?), offering a 60% increase in peak GPU performance and a 55% reduction in power consumption compared to the previous generation.
AI Prowess:
The Dimensity 8300 5G integrates MediaTek’s AI processor APU 780, featuring a generative AI engine with double the performance of integer and floating-point operations compared to the previous generation. This AI powerhouse supports Transformer arithmetic acceleration and mixed-precision INT4 quantization technology, delivering a comprehensive 3.3x increase in AI performance. This allows seamless operation of On-device generative AI applications, supporting up to 10 billion parameters AI big language models.
HyperEngine for Optimal Performance:
A highlight of the Dimensity 8300 5G is the inclusion of MediaTek’s new-generation “HyperEngine.” Leveraging unique performance algorithms, this engine provides real-time resource scheduling based on application performance requirements and device temperature information. The result is a high and stable frame rate gaming experience with low power consumption and extended battery life.
Memory and Imaging Advancements:
The chipset supports flagship LPDDR5X 8533Mbps memory, UFS 4.0 flash memory, and Multi-Circular Queue (MCQ) technology. This translates to a 33% higher memory transfer rate and a 100% improvement in flash read/write rates compared to the previous generation.
Equipped with a 14-bit HDR-ISP Imagiq 980 image processor, the Dimensity 8300 enhances computing and photography performance, elevating the photo and video recording experience. Users can capture clearer and sharper 4K60 HDR videos while enjoying extended battery life.
5G Connectivity and Power Efficiency:
The integrated 3GPP R16 5G modem provides a higher speed and stable 5G network experience. The Dimensity 8300 optimizes connectivity in weak signal environments, supporting 3-carrier aggregation and theoretical peak downlink rates of up to 5.17 Gbps. Additionally, MediaTek’s 5G UltraSave 3.0+ power-saving technology reduces 5G communication power consumption by up to 20%, ensuring long-lasting 5G usage.
Advanced Connectivity Features:
Wi-Fi 6E performance is enhanced with 160MHz bandwidth support, and the chipset supports Wi-Fi Bluetooth HyperConnect technology, enabling simultaneous connections to Bluetooth headsets, wireless grips, and other peripherals with lower latency.
Dimensity Open Architecture for Personalization:
The Dimensity 8300 5G supports Dimensity Open Architecture, offering a platform for more personalized and differentiated user experiences in end devices, unlocking the full potential of the chip.
Anticipated Smartphone Launch:
Smartphones featuring the MediaTek Dimensity 8300 5G mobile chip are expected to hit the market by the end of 2023, with the Redmi K70E slated as the first model to showcase the capabilities of this cutting-edge chipset.
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