Xiaomi Mi 10 Disassembling
Xiaomi mobile phone officially announced the Stereo cooling system design of Xiaomi Mi 10, which claims to use a “a bit exaggerated” three-dimensional cooling system, just recently Xiaomi mobile phone official micro has introduced the machine’s cooling system in detail including Xiaomi Mi 10 disassembling.
Xiaomi Mi 10 Disassembling – Highlights
- The super-large area VC heat-dissipating board is the largest area on the market at present, and it is three times the area of the VC Mate30 Pro 5G version .
- Graphene heat dissipation material, which dissipates heat for core flagships such as processors.
- 6 layers of graphite sheets covering almost the entire body, and independent graphite cooling is added to the camera and flash.
- A large amount of copper foil and thermally conductive gel are used to cover every small detail inside the machine.
Introducing of Xiaomi Mi 10 Cooling System
Xiaomi claims that the Mi 10 series has a new layout and many optimizations in terms of heat dissipation. A variety of heat dissipation materials, regardless of cost, constitute the most luxurious heat dissipation system currently available. Through the large-area VC, graphene, and multi-layer graphite to form a three-dimensional heat dissipation system, combined with multi-point thermistor monitoring, the Xiaomi 10 series can provide a cool and smooth user experience in high-load computing games, fast charging and 5G high-speed download.

According to the official, the Xiaomi Mi 10 series uses the current top VC heat-dissipating material, which is the largest VC on the market.

The working principle of VC soaking plate is to absorb heat from liquid to gas through phase change material. When the heat is transmitted from the heat source to the VC cavity, the cooling liquid in the cavity is heated to vaporize and absorb heat, and the volume rapidly expands to fill the entire cavity. The body will liquefy when it comes into contact with the area with low temperature. By the heat absorbed before the condensation is released, the cooled liquid will return to the heat source area through the wick.

The VC hot plate of the Xiaomi Mi 10 series covers the SoC, power management chip and 5G chip area at the same time, extending to the entire battery compartment. In terms of structural design, the traditional mobile phone VC soaking plate only contacts the middle frame at the edge, and the heat conduction efficiency is relatively limited. Xiaomi Mi 10 is customized and optimized on the stacked structure. The VC soaking plate and the middle frame use a large area of contact to greatly improve In order to improve the heat transfer efficiency, the heat of the VC soaking plate is quickly transferred to the middle frame for heat dissipation.
The 3050mm² super-large area VC heat-dissipating board, with full hot-spot overlay layout and large-area mid-frame contact, greatly improves the heat dissipation capacity of high-load computing, fast charging, and 5G high-speed downloading, quickly taking away core heat, efficient heat dissipation, Xiaomi 10 series is always calm.

The Xiaomi Mi 10 series also uses a unique graphene heat dissipation material. Graphene has very good thermal conductivity and is the carbon material with the highest thermal conductivity to date. The double-layer motherboard stacking structure used in the Xiaomi 10 series adds a graphene heat dissipation layer between the two motherboards, almost completely covering both motherboards The contact space between them greatly improves the thermal conductivity between the two-layer motherboards.

In addition to the super-large area VC heating plate, the Xiaomi Mi 10 series also built-in 6 layers of graphite sheets to supplement heat dissipation, making the overall temperature of the phone more uniform. The internal graphite coverage of the mobile phone reaches more than 70% of the whole device, and the large area graphite sheet on the back completely covers the entire back plate, and at the same time covers the upper and lower sound chambers. And around the key heating components, Xiaomi Mi 10 has added an independent graphite heat dissipation cover. For example, a double-layer graphite that is specially used for heat dissipation of the camera is added under the camera, and a dedicated graphite is equipped around the flash.

In addition, Xiaomi 10 uses a large amount of copper foil and heat-conducting gel inside, and the heat dissipation ability covers every small detail inside the machine. With the large-area VC soaking plate, graphene, and 6-layer graphite structure, it forms a top and bottom for the motherboard. The sandwiched sandwich structure constitutes a three-dimensional and efficient omnidirectional cooling system, which greatly improves the overall cooling capacity of Xiaomi Mi 10.
In addition, the Mi 10 series has a built-in matrix temperature sensor. Multiple temperature sensors are arranged inside the machine, which can accurately sense the temperature of different regions such as 5G chips, CPUs, cameras, batteries, and charging interfaces. monitor.

Not only that, relying on multiple internal temperature sensors, Xiaomi Mi 10 adopts AI-based machine learning-based temperature control strategies. It conducts thermal tests on more than 20 user scenarios in the laboratory and records transient temperature changes on hundreds of thousands.
The temperature sampling data is used to establish a mathematical model, and the surface temperature of the mobile phone in different scenarios is constructed by machine learning methods, and the case temperature model is established. Through the real-time temperature data of different areas of the mobile phone, the most suitable AI temperature control model is matched, and the temperature control strategy of the whole machine is reasonably adjusted to make the temperature control of the mobile phone more precise and delicate.
Known Features
The Xiaomi Mi 10 series will be equipped with the Snapdragon 865 processor, and the entire series will use LPDDR5 memory, WiFi 6, UFS 3.0 storage; which result makes Xiaomi Mi 10 top performing in current flagship phones. In terms of camera, it uses rear-mounted 108MP vertical four-camera.
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