Apple’s Pursuit of Thinner PCBs
In recent developments, Apple’s ambitious plan to employ resin-coated copper foil (RCC) as a new printed circuit board (PCB) material in their devices, creating thinner PCBs, has hit a temporary setback. While the news of this innovative approach garnered attention in September, renowned analyst Ming-Chi Kuo suggests that Apple won’t implement RCC technology until at least 2025.
RCC boasts the potential to reduce the thickness of PCBs, effectively freeing up precious space inside compact devices such as iPhones and Apple Watches. This newfound space could be utilized for larger batteries or other essential components, enhancing device performance and battery life.
The primary advantage of RCC lies in its fiberglass-free composition, simplifying the drilling process during manufacturing. However, despite its potential, Apple has encountered challenges due to its “fragile nature” and the inability of RCC to pass drop tests, according to Kuo’s research note.
Ajinomoto, a key supplier of RCC material, is in collaboration with Apple to improve RCC’s characteristics. Kuo believes that if this collaboration yields fruitful results by the third quarter of 2024, Apple may consider deploying the RCC technology in their high-end iPhone 17 models in 2025.
For consumers, this means that while Apple’s pursuit of thinner PCBs has encountered a delay, it also signals a commitment to delivering durable and reliable devices. Apple’s dedication to innovation and product excellence remains steadfast, with an eye on enhancing the user experience through cutting-edge technology.
In conclusion, the tech giant’s journey towards thinner PCBs using RCC material may be postponed, but the wait could lead to a more robust and innovative future for Apple devices, setting the stage for the high-end iPhone 17 models in 2025.