Huawei Mate 60 Pro Shatters US Sanctions Barrier
In a recent disassembly report published by TechInsights, the Huawei Mate 60 Pro has come under the spotlight for its technological advancements, sparking discussions about the state of semiconductor innovation and China’s role in the global tech landscape. This disassembly has not only raised eyebrows but also ignited debates about the pace of technological progress and the implications of global trade and innovation.
Breaking Down the Findings
The Huawei Mate 60 Pro, equipped with the Kirin 9000s chipset, has been meticulously dissected and analyzed by experts from TechInsights, a renowned semiconductor industry watchdog. Their findings shed light on the intricacies of this remarkable smartphone and, in particular, the state of its 5G chip technology.
According to TechInsights, the Kirin 9000s chipset falls behind the cutting-edge semiconductor technology by approximately 2-2.5 nodes. This implies that there remains a technological gap of 3 to 5 years when compared to the most advanced 5G chips, as perceived by Western countries’ technological advancement speeds.
China’s Speed of Progress
In response to this assessment, Lv Tingjie, a professor at Beijing University of Posts and Telecommunications and executive vice president of the China Society for Information Economics, noted that China has a unique ability to bridge this gap rapidly. He highlighted that while the Western world may project a 3 to 5-year delay, China often surprises with its rapid advancements. However, he cautioned that the progress from 7nm to 5nm to 4nm is a complex and demanding R&D process, emphasizing that there is much work ahead.
Lv Tingjie also acknowledged that the localization of the Kirin 9000s chipset, in addition to over 10,000 components, is a significant achievement. This achievement implies that China has made substantial progress in solving the “neck” problem in the 5G smartphone chip domain. Nevertheless, the gap in advanced process technology remains a challenge. Achieving advanced process chips necessitates addressing various links, from design software to lamination and lithography. Notably, successful process control, which impacts chip yield and commercial viability, is a crucial area of progress.
TechInsights’ vice chairman expressed amazement and surprise at Huawei’s Mate 60 Pro. This sentiment was shared by many, given the rapid advancements seen in China’s semiconductor technology. The speed at which Huawei conquered 7nm technology left observers impressed and curious about the unique technological advancements or solutions employed in this achievement.
Global Impact and Debates
The disassembly report of the Huawei Mate 60 Pro has garnered international attention, sparking discussions about the impact of US sanctions on Chinese innovation. Stephen Roach, a former chief economist at Morgan Stanley and a senior fellow at Yale University, pointed out the consequences of US actions against Huawei. He questioned whether these actions were aimed at constraining or incentivizing Chinese innovation.
Remind me of the point of US sanctions — to constrain or incentivize Chinese innovation? As China quickly closes the gap, the US resorts to the CHIPS Act and the failed industrial policies of the past. America’s strategic quagmire.Stephen Roach
Roach’s comments echo concerns that despite US export controls and sanctions, China continues to make significant strides in the semiconductor field. In the case of 5G technology, China has surpassed the United States, raising questions about the validity of claims that China is “stealing” American technology. Roach emphasized that this strategic approach by the United States could be a serious mistake with far-reaching consequences.
Even prominent US media outlets like Bloomberg and The Washington Post have taken notice, acknowledging that the Huawei Mate 60 Pro signifies a new pinnacle in China’s technological capabilities, despite strict export controls.
The disassembly of the Huawei Mate 60 Pro has sparked a global conversation about the pace of technological innovation, China’s ability to bridge gaps rapidly, and the implications of US sanctions on Chinese tech companies. While China has made remarkable strides, particularly in the localization of chipsets, there are still challenges ahead in achieving advanced process technology. As technology continues to evolve, the world watches closely to see how these developments shape the future of global innovation and trade.