Snapdragon X75 Modem New Record
In a groundbreaking announcement today, Qualcomm has unveiled its latest innovation in 5G technology—the Snapdragon X75 5G modem. This cutting-edge modem boasts remarkable capabilities, achieving up to a staggering 7.5Gbps downlink transmission speed using the Sub-6GHz band. This achievement marks a new record in 5G data rates, further solidifying Qualcomm’s leadership in the field.
The Snapdragon X75 5G baseband chip, introduced earlier this year, stands as the world’s first “5G Advanced-ready” baseband chip. The chip’s standout feature is its support for ten-carrier aggregation, promising an impressive 10Gbps downlink speed potential. This remarkable performance extends to both Wi-Fi 7 and 5G networks, offering users an unparalleled level of connectivity.
The Snapdragon X75 has already begun sampling, with commercial devices anticipated to hit the market in the latter half of 2023. These devices will span a wide range of applications, including smartphones, mobile broadband, automotive, computing, industrial IoT, fixed wireless access (FWA), and 5G enterprise private networks, ushering in a new era of high-speed, reliable connectivity.
As Qualcomm’s sixth-generation 5G modem and RF system, the Snapdragon X75 boasts an array of features that elevate 5G capabilities. Notably, it supports quad-carrier aggregation based on the TDD band and incorporates 1024QAM technology. These innovations enable unparalleled downlink transmission speeds in the Sub-6GHz band within 5G standalone (SA) network configurations.
The impressive downlink speed record was achieved through meticulous testing in a 5G self-contained (SA) network configuration. By leveraging carrier aggregation and 1024QAM technology, the Snapdragon X75 achieved a remarkable throughput of 7.5Gbps, demonstrating its prowess in pushing the boundaries of connectivity.
Beyond its unparalleled speed capabilities, the Snapdragon X75 boasts full-band support ranging from 600MHz to an impressive 41GHz. Moreover, it integrates millimeter-wave (mmWave) hardware (QTM565) with Sub-6 hardware, consolidating all 5G connectivity into a single module. This integration enhances efficiency, reducing physical space requirements by 25 percent and boosting energy efficiency by 20 percent compared to its predecessor, the Snapdragon X70.
The advancements in artificial intelligence (AI) are equally noteworthy. The Snapdragon X75 sets a new standard by featuring a dedicated hardware tensor accelerator, delivering a remarkable 2.5x increase in AI performance compared to the Snapdragon X70. This enhancement paves the way for exciting AI-driven applications and experiences.
Qualcomm has also made significant strides in positioning accuracy, thanks to GNSS Positioning Gen2. With positioning accuracy improved by 50 percent, not only does this reduce power consumption, but it also enhances connection stability. Coupled with the new Gen2 Intelligent Networking option, the Snapdragon X75 ensures a seamless and reliable user experience.
Looking ahead, the Snapdragon X75 is poised to be integrated into the next generation of flagship chips, potentially including the highly anticipated Snapdragon 8 Gen3 chip. Its global adoption as a cornerstone of upcoming flagship phones underlines its pivotal role in shaping the future of connectivity.
In summary, Qualcomm’s unveiling of the Snapdragon X75 5G modem sets a new benchmark in 5G performance. With record-breaking speeds, enhanced AI capabilities, and improved positioning accuracy, this cutting-edge technology promises to redefine the way we experience connectivity across a multitude of devices and applications.
