Apple Trials SoIC with InFO
Recent reports from Taiwanese media MoneyDJ have revealed that Apple is taking significant strides in embracing cutting-edge semiconductor technology. Following in the footsteps of AMD, Apple is currently conducting trial production of the latest 3D small chip stacking technology known as SoIC (system integrated chip). This revolutionary technology is expected to be used in future MacBook models, with a projected release timeframe between 2025 and 2026.
Taiwan Semiconductor Manufacturing Company (TSMC) is at the forefront of this innovative approach with its groundbreaking SoIC technology, touted as the industry’s first high-density 3D small chip stacking solution. Through the Chip on Wafer (CoW) packaging technology, SoIC enables the integration of chips of varying sizes, functions, and nodes in a heterogeneous manner. The capability to stack chips with diverse attributes empowers engineers to develop powerful and efficient systems for advanced electronic devices.
In the case of AMD, they were the pioneering customer for TSMC’s SoIC technology, employing it in their latest MI300 with CoWoS (Chip on Wafer on Substrate). This integration has enhanced the performance and efficiency of their microprocessors, propelling the technological landscape in the semiconductor industry.
Apple, on the other hand, plans to utilize SoIC with Integrated Fan-Out (InFO) packaging solution, considering various factors such as product design, positioning, and cost. InFO packaging technology involves the redistribution of input/output (I/O) connections from the die to the package substrate, effectively eliminating the need for a traditional substrate. This innovative approach results in a more compact design, improved thermal performance, and a reduced form factor, making it an ideal fit for future MacBook models.
As SoIC technology is still in its early stages, the current monthly production capacity is approximately 2,000 units. However, experts project that this capacity will continue to grow exponentially in the coming years, fueled by the increasing demand for consumer electronics products utilizing this cutting-edge technology.
The collaboration between TSMC, AMD, and Apple in adopting SoIC and InFO solutions represents a significant leap forward in the semiconductor industry. If successfully introduced into bulk consumer electronics products, this technology is expected to generate higher demand and capacity, encouraging other major customers to follow suit.
