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Xiaomi CIVI 3 to Debut New MediaTek SoC for Enhanced Imaging Capabilities

by Kamlesh Bhati
May 18, 2023
Xiaomi CIVI 3 to Debut Dimensity 8200-Ultra
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Xiaomi CIVI 3 to Debut Dimensity 8200-Ultra

Xiaomi has officially revealed some exciting details about its upcoming smartphone, the Xiaomi CIVI 3. The company announced that the CIVI 3 will be equipped with the world’s first Dimensity 8200-Ultra chipset, marking a significant milestone in smartphone technology.

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Xiaomi CIVI 3 to Debut Dimensity 8200-Ultra

This high-performance core is specifically designed to cater to the imaging capabilities of the device, highlighting Xiaomi’s commitment to providing exceptional camera features. According to Xiaomi, the integration of the Dimensity 8200-Ultra chipset with its proprietary Xiaomi Imaging Brain technology will result in a transformative imaging experience. The Xiaomi Imaging Brain has been fully adapted and optimized for the MediaTek Dimensity platform, facilitating enhanced image processing and accelerating performance.

This partnership between Xiaomi and MediaTek has led to two major technical upgrades for the Dimensity mobile chip. Firstly, Xiaomi’s image operator has been substantially enhanced and accelerated, enabling seamless and efficient image processing. Secondly, more than 30 Xiaomi imaging functions will make their debut on the Dimensity platform, further expanding the device’s imaging capabilities.

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Xiaomi CIVI 3 to Debut Dimensity 8200-Ultra

MediaTek, in collaboration with Xiaomi, has also expressed excitement about the Dimensity 8200-Ultra’s debut in the Xiaomi CIVI 3. In a video released on MediaTek’s official Weibo account, they highlighted the imaging specialty core, a feature jointly defined by MediaTek and Xiaomi. The integration of this core into the Dimensity 8200-Ultra chipset is expected to deliver exceptional image quality and performance.

In addition to the imaging enhancements, the Xiaomi CIVI 3 is set to support 5G hetero-network roaming. This feature allows users to seamlessly access and utilize another carrier’s 5G network in areas without coverage from their primary carrier. By reducing signal blind spots, this capability ensures a more convenient and uninterrupted 5G network experience.

While the official release date and appearance of the Xiaomi CIVI 3 are yet to be announced, anticipation for the device is growing. With the powerful Dimensity 8200-Ultra chipset, over 30 Xiaomi imaging functions, and the added convenience of 5G hetero-network roaming, the Xiaomi CIVI 3 promises to offer a remarkable smartphone experience. Fans and tech enthusiasts alike eagerly await further details from Xiaomi in the coming days.

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