MediaTek Dimensity 1050, Dimensity 930, and Helio G99
Entering the 5G era, MediaTek has turned around and risen to the top, releasing a series of mid-to high-end mobile platforms, including the recently talked-about Dimensity 9000.
Undeniably, the Dimensity 9000 energy efficiency performance is good, but only supports Sub-6G band 5G, compared to Snapdragon 8 Gen1 less 5G millimeter-wave support, but the Dimensity 9000 mainly for the Asian market, the lack of millimeter-wave impact is not significant.
Today, on May 23, MediaTek officially released its first mobile platform to support 5G millimeter-wave – Dimensity 1050, support for 5G millimeter-wave and Sub-6GHz full-band network dual connection switching.
In terms of parameters, the Dimensity 1050 uses TSMC’s 6nm process and is equipped with an octa-core CPU, consisting of two large 2.5GHz Arm Cortex-A78 cores, and six 2.0GHz Arm Cortex-A55 cores.
With a new generation of Arm Mali-G610 GPU, while also supporting MediaTek HyperEngine 5.0, LPDDR5 memory, and UFS 3.1 flash memory; support FHD+ resolution 144Hz refresh rate display.
Imaging capabilities integrated Imagiq 760 ISP, up to 108 MP main camera, support dual camera HDR video capture engine, equipped with APU 550 to enhance the AI camera function and provide excellent noise reduction for dark light shooting. Other connections also support Wi-Fi 6E 2×2 MIMO, Beidou III-B1C GNSS, Bluetooth 5, and more.
Officially, the terminal with the Dimensity 1050 5G mobile platform is expected to be available in the third quarter of 2022 and is expected to be mainly for the European and American markets.
MediaTek also updated the Dimensity 930 5G mobile platform and Helio G99 4G mobile platform supporting the 4G LTE network, further enriching the mobile platform portfolio.
MediaTek Dimensity 930 packs an octa-core CPU featuring Arm Cortex-A78 processors with frequencies up to 2.2GHz, plus the latest IMG BMX-8-256 GPU. Support for LPDDR5 and UFS 3.1.
MediaTek Helio G99 is a 4G mobile chipset that uses TSMC N6 (6nm-class) chip production process. It features an octa-core CPU with two high-performance Arm Cortex-A76 processors clocking up to 2.2GHz and a highly capable Arm Mali G57-class GPU. High-performance LPDDR4X memory up to 2,133MHz and UFS 2.2 storage.