Vivo X Fold Display Assembly Reveals Two 3D Ultrasonic Fingerprint Elements

Vivo X Fold Display Assembly

Vivo X Fold Display Assembly

In April, Vivo is expected to debut its own first foldable display phone belonging to Vivo X Series. According to Vivo’s vice president Jia Jingdong, the “Explore and Innovate” mission of the original NEX series will not disappear and will be carried by our flagship X series.

Therefore, there is news that Vivo’s first folding screen is attributed to the latest X series, named Vivo X Fold, equipped with Snapdragon 8 Gen1 and supports under-screen fingerprint recognition.

From the previous reports, Vivo X Fold uses the outer screen centered single hole micro-curved + inner screen right half screen centered single hole, engineering machine is Samsung 2K + 120Hz E5 LTPO screen, support DC dimming. The outer screen is covered with UTG glass, and the new shoulder key crease control is very good.

According to a picture of a folding screen phone circulating online, if it is the Vivo X Fold, the crease in the middle of the machine is indeed well controlled and almost invisible.

Vivo X Fold Display Assembly

In today’s morning, a Weibo blogger shared a picture of the internal structure of the Vivo X Fold display assembly. As we can see in the picture, you can see that the two display assemblies are integrated with 3D ultrasonic fingerprint elements, which is also the industry’s rare foldable display with an under-screen fingerprint program.

Earlier, Sparrows News covered that X Fold will use the strongest hinge which is from one of Apple’s supply volume manufacturers. According to the report, the X Fold uses a hinge that costs more than 1,200 yuan due to the addition of multiple aerospace materials, making it the most costly folding screen hinge on the market today.

The benefit is that the number of folding has a greater improvement, or the use of neodymium-iron-boron material magnets to counter the tension of the UTG glass, to ensure that it can also have good performance in extreme conditions.

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