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Dimensity 8100 Specifications Leaked: Benchmarked Against SD888 and Kirin 9000

by Kamlesh Bhati
February 25, 2022
Dimensity 8100 Specifications and Benchmarking
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Dimensity 8100 Specifications and Benchmarking

MediaTek’s Dimensity 9000 has been mass-produced commercially, the first model for the OPPO Find X5 Pro Dimensity version. After the Dimensity 9000, MediaTek Dimensity 8000 series chip will soon debut, it is benchmarked against Qualcomm Snapdragon 888.

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Today, well-known Weibo blogger Digital Chat Station revealed MediaTek Dimensity 8100 specifications, which uses TSMC’s 5nm process and consists of four Cortex A78 large cores at 2.85GHz CPU and four Cortex A55 small cores at 2.0GHz CPU, with a GPU of G610 MC6. In terms of running score, the integrated score of AnTuTu Benchmark scores of Dimensity 8100 exceeds 820,000 points, surpassing Snapdragon 888.

In addition, the report points out that the Redmi K50 Pro is equipped with the Dimensity 8100 chip, while Redmi’s oversized cup K40 Pro+ released last year is equipped with the Snapdragon 888, which means that the Redmi K50 Pro’s performance outperforms the Redmi K40 Pro+.

For this, Digital Chat Station also shared prototype test results of the Dimensity 8100. According to the report, prototype test GFX ES 3.0 170fps±, the results and Snapdragon 888/Kirin 9000 are almost comparable. TSMC N5 pressure four cores A78, three-level cache, and Snapdragon 888 are the same 4MB, LPDDR5, and UFS 3.1 is also supported.

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Purely from the test upgrade, Dimensity 8100 can already be a tie with the previous generation of top flagships, but in terms of heat dissipation and other aspects that may be stronger than Snapdragon 888, the experience will be more friendly, while the price is low instead.

Source 1, Source 2

Tags: Latest NewsMediaTek
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