Standard Redmi K50 Series 3C Certified
A few days ago, Redmi officially announced that the first masterpiece of the opening year – K50 Gaming Edition will be officially released on February 16, with the Snapdragon 8 Gen1, pop-up shoulder key 2.0, super large area dual VC cooling system and other features, the machine is expected by many consumers.
Besides the gaming phone, Lu Weibing also confirmed that the standard Redmi K50 Series will also launch soon and will bring a Dimensity flagship processor. Meanwhile, Digital Chat Station brought the latest news of the standard Redmi K50 Series today.
He spotted Redmi’s three new models (22021211RC, 22041211AC, 22011211C) in 3C Certification database. This shows that the device will support 67W, 67W, and 120W max charging support respectively representing Redmi K50, K50 Pro, and Redmi K50 Pro+, equipped with Snapdragon 870, Dimensity 8000, and Dimensity 9000 chips respectively.
It is reported that Dimensity 8000 is MediaTek’s upcoming sub-flagship chip, positioning second only to Dimensity 9000. The chip is built based on TSMC’s 5nm process, consisting of four Cortex A78 large cores and four Cortex A55 small cores, with a CPU main frequency of up to 2.75GHz and a GPU of Mali-G510 MC6.
In addition, this time the Redmi K50 Pro+ will be used to impact the high-end price segment, although equipped with MediaTek processors, the Dimensity 9000 is very strong in terms of parameters and performance this time, not inferior to the Snapdragon 8 Gen1.