Xiaomi 12 Internal Diagram and Cooling System
Xiaomi has previously officially announced that a new conference will be held on December 28 to launch a new generation of flagship models – the Xiaomi 12 Series.
Early this morning the official began for the screen information preview, has announced several information, it is now known that its entire system uses a dual-curved design, the front camera for the center of the hole, the rendering looks good, but for the final effect, there are still some doubts.
Recently, Xiaomi 12’s product manager Wei Siqi finally announced the first real picture of the new machine, showing the screen of Xiaomi 12 on the front. From the actual picture, Xiaomi 12 curved screen curvature is very restrained this time a slightly curved feeling, the overall and 2.5D similar, only a small part of the screen display area in the curved range, and the width of the upper and lower bezel is equal to the width of the state, the overall visual very comfortable.
In addition, the R angle previously criticized by some users in the Xiaomi 11 series is finally normal, after the elimination of the four curved surfaces, the screen, and the bezel remain the same, coupled with the front camera centered on the hole, the left and right are completely symmetrical effect, a glance looks significantly more beautiful than the previous generation.
It is worth mentioning that on this real picture of Xiaomi 12, it also shows the actual VC even heat plate size inside the phone, which can see that a great deal of effort has been put into heat dissipation, and if the new Snapdragon 8 Gen1 can eventually be suppressed, it will bring a very good experience in terms of performance.
Xiaomi officially said that the Xiaomi 12 will have three major technological breakthroughs:
Today, the smartphone motherboard has a very high stocking density, for a small size flagship phone that can use the space is not rich, how to reasonably design the motherboard is a challenge. To this end, the Xiaomi 12 comes with Xiaomi’s smallest and highest density 5G motherboard to date, with a sandwich structure that enables high-density three-dimensional stacking of components, reducing device spacing by 23% and increasing the number of devices by 10% while reducing the motherboard area by 17%.
While the high-density motherboard stack solves the space problem, it brings new challenges in heat dissipation. The Xiaomi 12 uses a 2600 square millimeter VC heat sink, which is only 0.3mm thick, and uses an improved Mesh process to provide effective temperature control while not taking up too much space on the phone.
The reduced size will of course also affect the size of the battery, and the capacity of the battery has become a challenge. Xiaomi 12 uses a current Xiaomi highest density fast-charging battery, this new generation of lithium cobalt-acid battery has a “large-capacity” according to the official description, and for the first time the battery negative pole shunt, the temperature of the battery charging to achieve effective control.
