TSMC 4nm Snapdragon 8 Gen1 Still Has Heating Problem

TSMC 4nm Snapdragon 8 Gen1 Feedback

TSMC 4nm Snapdragon 8 Gen1 Feedback

Qualcomm officially released a new generation of Snapdragon 8 Gen1 processor at the beginning of the month, which is built using Samsung’s 4nm process, with significant improvements in CPU/GPU compared to both Snapdragon 888 and 888 Plus, and a runtime score that breaks the 1 million points on AnTuTu Benchmark.

But friends familiar with SoC may start to worry after seeing the parameters of this chip release because Samsung often means heat, and this seems to be certified after some media testing Moto Edge X30, so everyone is looking forward to TSMC 4nm Snapdragon 8 Gen1, hoping for an improvement.

However, Digital Chat Station today brought the breaking news: “MT6983 and SM8475 current sample feedback are still hot, TSMC 4nm power consumption reduction is not a lot. There is a contrast to hurt. The heat mentioned here is definitely not as hot as the 8450, and the power consumption is indeed reduced, but it is not as big as expected.”

This means that the upgraded version of Snapdragon 8 Gen1 Plus based on TSMC’s 4nm process is not as ideal as we all thought, compared to Samsung’s 4nm process, the power consumption and heat generation are more limited, and can only be said to be a routine upgrade and upgrade it.

The small upgraded version of Snapdragon 8 Gen1 Plus will be released in the second half of next year, as the standard for flagships in the second half of 2022, which is a strategy that Qualcomm has been using for several years now.

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