Dimensity 7000 Specifications Unveiled; MediaTek Holds Conference On December 16th

MediaTek Dimensity 7000 Specifications Exposure

MediaTek Dimensity 7000 Specifications Exposure

In today’s morning, MediaTek official Weibo released a teaser, saying that it will hold the Dimensity flagship strategy and new platform launch on December 16th. This 4nm flagship processor from MediaTek was released globally back on the 19th of this month, and this domestic launch is expected to bring some new news, and maybe some particularly well-connected cell phone manufacturers will stand together.

In terms of specifications, the Dimensity 9000 uses TSMC’s 4nm process + ARMv9 architecture combination, with a high-performance Cortex-X2 mega-core, three Cortex-a710 large core (2.85GHz), and four Cortex-A510 energy-saving cores, supporting up to 7500 LPDDR5X memory at up to 7500 Mbps.

As for the image signal processor, the Dimensity 9000 is also equipped with a highly efficient flagship 18bit HDR-ISP solution with a processing speed of 9 billion pixels per second, capable of supporting HDR video recording from three cameras (supporting 320 million pixels) simultaneously. On the graphics side, the Dimensity 9000 has an integrated Mali-G710 deca-core GPU and a mobile-oriented LightChase SDK package that can easily drive 180 Hz high refresh FHD+ resolution screens.

In addition, according to several exposures, MediaTek Dimensity 7000 is also at work, and the possibility to be released on this event can’t be ruled out. Today, Digital Chat Station also revealed MediaTek Dimensity 7000 specifications. News speculates that the current prototype is using TSMC 5nm process to build, it packs 4 × 2.75GHz A78 + 4 × 2.0GHz A55 cores and uses Mali-G510 MC6 GPU and ARM’s new architecture.

Source 1, Source 2

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