Samsung will use the CSP Package Process
Samsung Electronics’ image sensors are currently packaged in COB packages, where the image sensor is placed on a PCB and connected by wires, to which the lens is attached. COB is currently the most common packaging method for image sensors. However, the process requires a clean room because the components may be exposed to unwanted materials during the encapsulation process, which introduces an increase in cost.
According to TheElec, to save costs, Samsung Electronics plans to use CSP (Chip Scale Package) for low-resolution image sensors starting from next year.
CSP package process first packages the image sensor chip and then connects it to the board without soldering wires. Compared to the COB, the process is simpler, does not require a cleanroom, can save costs, and the entire process is done at the wafer level, making production more efficient.
The downside is that CSP can only be done in low-resolution image sensors, and most higher-resolution image sensors are still based on COB packages. However, CSPs are evolving to support higher resolutions, currently supporting FHD resolutions, and are increasingly being used in low-resolution camera modules.
Samsung Electronics’ intention to move to CSPs comes at a time when increasing competition in the smartphone market is forcing manufacturers to lower prices. Image sensors are also a relatively expensive component in smartphones, adding to manufacturers’ incentives to save costs.
At the same time, the source added, Samsung also plans to expand cooperation with companies that can provide low-resolution image sensors to diversify suppliers and further reduce costs.