Snapdragon 898: The New Big Fireplace
The director of the small new series of products Lenovo Legion and Yoga Series today posted that, “The new big fireplace… The phone to play the platform performance is also increasingly testing the heat dissipation.”
Indicating that a new platform of cell phone chips seems to heat up seriously, so after the launch of the new machine are also more test cell phone manufacturers for the design of thermal solutions merits to unlock the full power of the processor.
This new chip undoubtedly upcoming Snapdragon 898 (SM8450), which Lenovo previously claimed to be working on it for the Legion 3 Pro gaming phone. Qualcomm’s next flagship processor is expected to be released at the 2021 Snapdragon Technology Summit.
Despite the upgrade to Samsung’s 4nm process, the heat situation doesn’t seem to have improved much, but the performance can be improved by up to 20%, so the manufacturer needs to work hard on heat dissipation technology. In meantime, Xiaomi already shared the new Loop LiquidCool Technology, what the new cooling system Lenovo will bring, we have to wait until the official reveal.