Xiaomi’s Loop LiquidCool Technology: Next-generation Xiaomi Heat Dissipation Technology Demonstration
As the performance of cell phones improves, in addition to the core parameters, heat dissipation configuration has gradually become the focus of attention, such as strong heat dissipation can maintain a long time CPU/GPU high frequency, to have better performance and game performance.
At present, cell phone cooling is broadly divided into two kinds, one is active cooling, relying on another accessory for auxiliary cooling, such as the fan of the gaming phone, the other is common passive cooling, to VC liquid cooling or other materials composition.
Today, Xiaomi’s next-generation heat dissipation technology named “Xiaomi Loop LiquidCool Technology” is officially announced. It’s a self-research ring cold pump cooling technology, claimed to be the future-oriented cooling technology.
Officially, next-generation Xiaomi heat dissipation technology refers to the aerospace satellite cooling method, the coolant pumped to the phone heating area, through the vapor-liquid phase change, so that heat conduction at high speed, forming a smooth one-way cooling loop.
Officially, the loop cold pump consists of an evaporator, condenser, compensation cavity, and vapor and liquid pipes. The evaporator is in the heat source area of the phone’s mainboard, and when the processor and other heat sources operate at a high load, the cold liquid evaporates into a vapor state and drives airflow into the vapor pipes through natural expansion.
When the vapor flows into the condenser, condensing into liquid, through the capillary force inhaled liquid pipeline and then back to the compensation cavity for the evaporator for cold liquid replenishment, so the cycle, no additional power. Although the principle of phase change is the same as VC liquid cooling, due to the different structures, the actual effect is very different.
Conventional VC liquid cooling is unable to separate vapor and liquid, so the hot vapor moving toward the condenser and the cold liquid returning to the evaporator move in opposite directions and obstruct each other, which makes it difficult to return the liquid under high load conditions.
At the same time, the annular cold pump, due to the special vapor piping design, has a significant 30% reduction in airway resistance and smoother vapor flow, thus allowing heat to be directed to the cold end over long distances, resulting in a 100% increase in maximum heat transfer power.
The reason for the one-way circulation is the increase of Tesla valve structure in the compensation cavity, similar to the one-way valve effect, the liquid is released normally through the Tesla valve from the liquid pipeline to the evaporator in the forward circulation, while the steam is released from the evaporator to the compensator in the reverse circulation, relying on the special design inside the Tesla valve to make the steam flow back to dislike each other can not be normal circulation, thus realizing the effect of one-way circulation and improving the efficiency of the gas-liquid circulation.
Through a Xiaomi Mi MIX 4 Magic Reform for real-world testing, the cooling part replaced with a ring-shaped cold pump, while using the “Original God” for 30 minutes of testing, in 60 frames + the highest quality can be full-frame continuous operation, the highest temperature of the body 47.7 ℃, compared to the highest temperature of ordinary Snapdragon 888 cell phone body 5 ℃ lower.
In addition, thanks to the Tesla valve bringing heat one-way flow, vapor-liquid separation, and low resistance vapor channel design, Xiaomi self-researched ring-shaped cold pump form can be freer, almost any form of stacking inside the fuselage.
Finally, the official said that the technology will be landed in mass production in the second half of 2022, according to Xiaomi’s product line, is expected to be Xiaomi MIX 5 first mass production?