Honor Magic 3 Durability Test Video
On the evening of August 12th, Honor will hold its most important launch of the year, officially launching its first top flagship after independence, and the most powerful phone Honor has ever made – the Honor Magic 3.
Recently, Xinhua News Agency carried out a series of reports on Honor and its various technologies, after Honor CEO Zhao Ming discussed the unrestrained ideas about AI technology with Go sage Nie Weiping and former CCTV host Zhang Quanling, and revealed some information about the Honor Magic 3.
The whole process of Honor Magic 3 Series birth is exposed in advance, Zhao Ming-George and Go sage Nie Weiping, former CCTV host Zhang Quanling into the Honor R&D center, witness Honor Magic 3 series is waterproof, drop, heat dissipation and call and other core features of the test process. The new graphene with ultra-high thermal conductivity and industry-leading 3D nano-microcrystalline process of Honor Magic 3 Series will arrive on August 12.Said, Honor Mobile.
We are honored to invite Nie and Mr. Zhang to enter the Honor R&D center together to experience the advanced process and innovative technology of the Honor Magic 3 Series. Honor Magic 3 Series will use the innovative material of graphene with super high thermal conductivity in the industry.Honor CEO Zhao Ming.
While sharing the Honor Magic 3 durability test video, Xinhua News Agency stressed that “See together, how AI makes life better. Do you know what cutting-edge technology is in your phone if you can’t live without it? How much AI technology is there in a cell phone?” Here are highlights of the video:
The video first shows the Honor Magic 3 waterproof performance test, you can see the machine in the simulation of deep water test, through the challenge of pressurized simulation 3-4 meters or even more deep water, to achieve the industry-leading waterproof performance, in the rain call without impact.
In addition, Zhao Ming also announced in advance that the Honor Magic 3 uses an industry-leading 3D nano-microcrystalline process, which can balance the hardness and strength of ceramic materials, as well as the 3D plasticity and high transparency of glass materials, which is excellent in terms of sturdiness and aesthetics, and perfectly passed the drop test.
As the current cell phone performance continues to improve, the internal heat dissipation requirements of the phone are increasingly high, especially since the chip area is a major heat generator, the phone’s heat dissipation performance has become the most important to protect the experience.
Zhao Ming introduced, Honor Magic 3 using ultra-high thermal conductivity new graphene for heat dissipation, which is a very high thermal conductivity of the material, through the AI technology support, it can maximize the performance of the chip.
This also coincides with the information previously revealed by Zhao Ming, who said at the launch of the Honor 50 series that the Snapdragon 888 models currently on the market are a mess of experience, and the main reason for this is the much-touted heat situation, resulting in chip downscaling and inability to perform.
At that time, Zhao Ming said that the Honor Magic 3 will bring a full-blooded Snapdragon 888 chip experience, which not only means that the machine will be equipped with a higher frequency Snapdragon 888 Plus, but also represents the Honor Magic 3 thermal performance of great confidence, will be perfect to play the most powerful core of this Android extreme performance, worth looking forward to.