Samsung uMCP LPDDR5 Memory and UFS 3.1 NAND Storage Multi-chip Announced

Samsung uMCP LPDDR5 and UFS 3.1 NAND, LPDDR5 uMCP

Samsung uMCP LPDDR5 and UFS 3.1 NAND

Samsung Electronics recently announced to the world that the company has begun mass production of its latest smartphone memory solution – Samsung uMCP LPDDR5 memory and UFS 3.1 NAND storage media, targeting mid-to-high-end handsets. Samsung says the goal of this new solution is to bring flagship-level performance to more smartphone users.

Samsung’s latest smartphone memory solution, the LPDDR5 UFS-based multi-chip package (uMCP) will be the industry’s first and will reportedly begin mass production and deployment in a mid-to-high-end smartphone this month.

Samsung uMCP combines the features of LPDDR5 memory and UFS 3.1 NAND flash to deliver the industry’s highest performance, capacity, and efficiency. Samsung claims that its uMCP improves DRAM performance by nearly 50 percent (17 GB/s to 25 GB/s) and doubles NAND flash performance (1.5 GB/s to 3 GB/s), a significant improvement over the previous LPDDR4X-based UFS 2.2 solution.

The new uMCP also maximizes the phone’s space utilization by integrating DRAM and NAND storage into a compact package chip measuring just 11.5mm x 13mm, leaving more space for other functions.

Samsung uMCP is said to be customizable with DRAM capacities from 6GB to 12GB and storage options from 128GB to 512GB. Samsung has completed LPDDR5 uMCP compatibility testing with several handset manufacturers and expects its uMCP-equipped devices to enter the mainstream market starting this month.


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