Honor Magic 3 Packs Top Qualcomm’s SoC, People Will Change the Phone after Seeing Magic Series

Honor Magic 3 Packs Top Qualcomm's SoC and Brand New Design

Honor Magic 3 Packs Top Qualcomm’s SoC

At Qualcomm’s Technology and Cooperation Summit, Honor CEO Zhao Ming said that the flagship and high-end products released in the future will use the Qualcomm Snapdragon platform. In the post-meeting interview, Zhao Ming said, in the Honor Magic 3, there is no doubt that we will use the industry’s leading flagship chip.

At the same time, he said that Honor will work together with Qualcomm to combine the understanding of consumer needs and product thinking with the powerful performance of Qualcomm Snapdragon while incorporating unique technical capabilities to achieve a more extreme user experience.

The Snapdragon 778G-equipped Honor 50 series is a new starting point for cooperation between Honor and Qualcomm, and the Magic series, the flagship of Honor’s all-around technology, will also use Qualcomm’s Snapdragon flagship-class mobile platform.

At the same time, on the Magic series, as consumers can see Honor’s understanding and design of the latest communication technology, as well as a new photography solution, probably the solution that represents the industry’s most leading photography technology, will be applied on the Honor Magic 3, as well as a new iconic design.

“I am very confident and certain that people will change the phone in their hands after seeing the Magic series”, this is Zhao Ming’s comment on the Magic 3.

Earlier’s report, claims that Honor is currently testing the Qualcomm Snapdragon 888 Pro chip, and the new machine is expected to hit the market in the third quarter of this year.

According to the latest news from the blogger, Honor will be one of the manufacturers to launch a new machine equipped with Snapdragon 888 Pro, and Honor will likely grab the first one, and it is said to be well polished.


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