Realme GT Neo 5G
Realme announced in an official post that it will hold a press conference at 2:30 pm (CN) on March 31 to officially launch – Realme GT Neo 5G. From a recent official preview, the Realme GT Neo is equipped with a Dimensity 1200 processor with an integrated 5G baseband, which is advantageous in terms of power consumption, so this phone should be well balanced in terms of power consumption and performance.
Xu Qi, vice president of Realme, said that Realme GT Neo 5G is the heavyweight product of realme’s dual-platform flagship strategy in 2021, equipped with a 6nm process MediaTek Dimensity 1200 chip, with powerful flagship-level performance. At the same time, the official also claimed that Realme GT Neo has a third-generation 5G cell phone all-around improved 5G terminal experience.
To explain in detail, Realme official article specifically issued a detailed explanation of the 5G performance of the Dimensity 1200 flagship chip, and said that the chip provides a 5G experience three years will not be out of date and highlights below features:
- 5G + 5G Dual Card Standby: support SA/NSA dual-mode group network under the dual card 5G standby, two cards at the same time 5G resident network, at any time intelligent switch signal better 5G network. At the same time, both cards support SA independent networking, adapt to the future 5G network environment, to get a complete 5G experience.
- Two 5G dual-carrier aggregation: Two 5G bands can be connected simultaneously and achieve faster network speeds through carrier aggregation, with exponentially faster download speeds in some bands compared to 5G single-carrier. When switching between different 5G bands, dual-carrier aggregation eliminates the need to disconnect and reconnect, enabling seamless switching and keeping the 5G network always online and significantly ahead of single-carrier stability.
- VoNR: Both calls and Internet access will be carried by the 5G network and compared with VoLTE, the call quality will be greatly improved with lower latency and higher quality of sound and picture to enhance user experience.
- Peak integrated 5C baseband: brings lower data latency, better power consumption, and temperature control performance, high integration helps to save the extremely valuable internal space of cell phones, allowing cell phone manufacturers to more finely arrange and combine the internal structure to get more battery and thinner body, integrated baseband has become the future trend.
In January this year, MediaTek officially released the Dimensity 1200 chip, using TSMC 6nm process, 1 Cortex-A78 large core 3.0GHz, 3 Cortex-A78 2.6GHz, 4 Cortex-A55 2.0GHz cores, performance increased by 22%, energy efficiency increased by 25%. The GPU size does not change much and the performance is improved by up to 13%.