Lenovo/Motorola Flagship Phone Rendering | Testing New Innovative Heat Dissipation System For Legion Phone 2
Not a long ago, “New products are getting closer…” said General Manager of Lenovo China Mobile Business Department – Chen Jin and exposed the packaging box of the device. Recently a new Motorola/Lenovo phone’s rendering appeared on the network. It may possible that this is the phone that Chen Jin teasing.
The front screen has a four-sided curved screen design, so from the front screen alone, it almost has a bezel-less design, but it also retains the physical power button and volume keys, and the screen has a center-mounted punch-hole screen, and the diameter of the hole also looks very small, which makes it look very high in value.
The rear lens uses a vertical matrix four-camera design, and the lens module is located in the center of the back of the phone, which looks pretty good, but not as shocking as the front screen looks. At the bottom, the SIM card slot, USB Type-C interface, and loudspeaker are located. The source mentioned both Lenovo and Motorola, so the device maybe from Lenovo?
In the meantime, Chen Jin also stated in a post that, Lenovo is testing a new heat dissipation system for the new product of the Legion Gaming Phone. Official already confirmed Legion Gaming Phone 2 will be coming with Snapdragon 888 5nm SoC. “Today, I’m talking about the heat of the new 5nm process chips. I secretly checked with my colleagues the innovative heat dissipation system of the new product of the Legion’s mobile phone, which undoubtedly maintained the full blood capacity of the industry.” Said, Chen Jin
It is said that Motorola’s new machine will also be equipped with Snapdragon 888 processor, in the positioning is also a flagship product, but it is not sure when this new machine will be in the market. This time may be Lenovo’s Lemon Series will also do a product with a new flagship SoC.
