Xiaomi 11 Teardown Video
Near the end of 2020, Xiaomi 11 was finally officially released, the starting price of 3999 also once again let many users shout “really good.” The configuration of Xiaomi’s phone is never lacking, so what is such strong hardware inside the body? This morning, some media issued a video of the Xiaomi 11 teardown.
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According to these bloggers “XYZone Lou Bin (楼斌XYZONE)” who disassembled Xiaomi 11 response, in terms of internal workmanship and materials, Xiaomi 11 is a very mature design solution, the arrangement of components is also extraordinarily precise, showing the level of flagship phones should have, and there are some special details done with more care. The following are some small details that may concern you.
- Snapdragon 888 and flash memory are sealed with adhesive treatment (sealed rubber processing), which can further enhance the safety of the phone when dropped and in water.
- Xiaomi 11 Camera Modules: the main camera CMOS is Samsung HMX, the macro is Samsung S5K5E9, the front is Samsung S5K3T2, the ultra-wide angle is OV13B10, no Sony program sensors used this time.
- The main camera glass cover using the same CNC integrated processing as the iPhone, macro lens directly using the cover glass, which puts a higher demand on the optical performance and flatness of the glass cover, the corresponding processing difficulty is also higher.
- Heat dissipation, the motherboard all covered with VC even thermal plate, and with the use of copper foil, graphite, silicone grease, aerogel, etc., the material is unambiguous.
- To reduce the chances of accidental touch curved screen, Xiaomi 11 new grip sensor, hardware with a two-pronged approach to software.
- The body temperature control, vegetal skin, and glass version of the same performance, HDR HD 60Hz chicken half an hour, the highest front about 41 degrees, the highest back about 40 degrees, “the original God” the highest quality of the highest temperature of 37 degrees Celsius for an hour.
- To know the Snapdragon 888 itself is still very touching heat, Jiang Zhenfang tries to remove all the cooling materials such as copper foil, metal shield found that this SoC can easily touch more than 80 degrees.
