OFILM 0.3mm ultra-thin VC uniform Heat-plate
New Breakthrough in Mobile Phone Heat Dissipation: OFILM successfully developed a 0.3mm ultra-thin VC uniform heat plate with 5W heat dissipation power
According to the IT Home, the Inc. on December 4, recently broke through the traditional copper network or copper powder sintered capillary core structure, and was the first in China to successfully develop a 0.3mm ultra-thin VC homogeneous heating plate by using precision etched microstructure integrated capillary core process, and reached a stable process level for mass production.
OFILM is the first company in China to develop a 0.3mm ultra-thin VC board by using etched capillary core, reducing the overall thickness by about 50um, which not only simplifies the process but also reduces the cost, making it possible for VC board to enter the middle and low-end cell phones.
According to OFILM, the thinnest VC uniform heat plate in mass production is 0.35mm, and the launch of the 0.3mm ultra-thin VC uniform heat plate undoubtedly provides more space for various product designs.
Besides, the etched capillary core and continuous support column structure support the flexible design of the product to achieve 180° bending, which is convenient for the thermal management design of various customer products.
At the same time, due to the special structure design and advanced technology, the etched capillary core used by OFILM has a liquid absorption capacity of 13.5cm, liquid absorption speed of 8mm/s, and can support 5W heat dissipation power, which can fully meet the heat dissipation needs of cell phones and other daily electronic products.