SPARROWS NEWS
  • Home
  • Latest News
  • Upcoming Events
  • Videos
  • Category
  • Contact Us
  • Author
No Result
View All Result
SPARROWS NEWS
No Result
View All Result
  • Phones
  • Events
  • Tablet
  • Wearable
  • Technology
  • REVIEW
  • Computer

ASML 1nm Lithography Machine Completed: Moore’s Law Not at End

by Kamlesh Bhati
December 1, 2020
1nm, The technology roadmap of EUV lithography system for process miniaturization of logic devices.

The technology roadmap of EUV lithography system for process miniaturization of logic devices.

197
SHARES
Twitter

ASML 1nm Lithography Technology

Moore’s Law to be extended beyond 1nm; IMEC and ASML to collaborate on the development of next-generation lithography technology

Mynavi

What is the endpoint of Moore’s Law? With the mass production of 5nm lithography and the breakthrough of 3nm, the end of Moore’s Law is becoming more and more elusive. What is certain is that as the process improves further, its cost increases exponentially.

RELATED POSTS

Smartphone Technology Advancements in 2023: What Excite Us

Realme 240W Fast Charging Solution Explained in Detail

OPPO MariSilicon Y – Bluetooth Audio Chip Featured in Video

According to reports from the Japanese media Mynavi, Luc Van den hove, CEO and President of IMEC, the European Microelectronics Research Center, said in an online presentation at a recent online event that progress has been made towards more advanced lithography in cooperation with ASML.

In the middle of this month, the ITF Forum was held in Tokyo, Japan. At the forum, IMEC, the Belgian semiconductor research organization that is working with ASML on the development of lithography, announced the technical details of the 3nm and below processes at the microscale level. At least for now, ASML has a clear roadmap for 3m, 2nm, 1.5nm, 1nm, and even Sub 1nm, and the 1nm era will see a significant increase in the size of the lithophones.

ASML has almost completed the design of the 1nm lithography machine.

Luc Van den hove, CEO and President of IMEC, gave the first keynote address, providing an overview of the company’s research and emphasizing the commercialization of the next generation of high-resolution EUV lithography, high-NA EUV lithography, through close collaboration with ASML. IMEC Inc. It was emphasized that the process of downsizing to 1nm and below would continue.

ADVERTISEMENT

Many semiconductor companies, including Japan, have withdrawn from process miniaturization, claiming that Moore’s Law has come to an end, or that it is too costly and unprofitable. While many lithography tool manufacturers in Japan have withdrawn from the EUV lithography development phase, semiconductor research institutions IMEC and ASML have been collaborating on the development of EUV lithography, which is critical for ultra-fine scales.

IMEC Announces Roadmap for Logic Devices Down to 1nm and Beyond

IMEC will present a roadmap for the miniaturization of logic devices at 3nm, 2nm, 1.5nm and below 1nm at ITF Japan 2020.

IMEC's roadmap for logic device miniaturization, asml 1nm lithography
IMEC’s roadmap for logic device miniaturization

The PP is the pitch (nm) for polysilicon interconnects and the MP is the pitch (nm) for fine metal wiring under the name of the upstream technology node. It should be noted that in the past technology nodes referred to minimum process dimensions or gate lengths, but now they are just “labels” and do not refer to the physical length of a location.

The structures and materials described here, such as BPR, CFET, and channels using 2D materials, have been published separately.

High NA of EUVs is essential for further miniaturization

According to TSMC and Samsung Electronics, starting with the 7nm process, some processes have introduced EUV lithography equipment with NA=0.33, and the 5nm process has also achieved an increase in frequency, but for ultra-fine processes after 2nm, higher resolution and higher lithography equipment NA (NA=0.55) need to be achieved.

The technology roadmap of EUV lithography system for process miniaturization of logic devices.
The technology roadmap of EUV lithography system for process miniaturization of logic devices.

According to IMEC, ASML has completed the basic design as a high-NA EUV exposure system for the NXE:5000 series, but commercialization is planned for around 2022. This next-generation system will be very tall due to its huge optics, most likely under the ceiling of a conventional cleanroom.

Current EUV lithography system (NA=0.33) (front) compared to the next generation of high NA EUV lithography system (NA=0.55) (back).
Current EUV lithography system (NA=0.33) (front) compared to the next generation of high NA EUV lithography system (NA=0.55) (back).

ASML has been working closely with IMEC in the past to develop lithography technology, but to develop lithography processes using high NA EUV lithography tools, a new “IMEC-ASML High NA EUV Lab” has been established on the IMEC campus to facilitate joint research and development of lithography processes using high NA EUV lithography process for tools. The company also plans to work with material suppliers to develop masks and resists.

IMEC-ASML High NA EUV Laboratory
IMEC-ASML High NA EUV Laboratory

In addition to these four goals, as miniaturization moves to 3nm, 2nm, 1.5nm, and even beyond 1nm to sub-1nm, we will strive to achieve the following Microprocessors that are environmentally friendly and suitable for a sustainable society. He showed great enthusiasm to continue his commitment to process miniaturization.

Emphasizing PPAC-E, he added E (environmental) process miniaturization to the traditional PPAC.
Emphasizing PPAC-E, he added E (environmental) process miniaturization to the traditional PPAC.

SOURCE

Tags: Latest News
Tweet49ShareShare14

Related Posts

HONOR Magic 5 Clear Certification
Phones

HONOR Magic 5 Clear Certification; New Lens to Compete with IMX989

February 3, 2023
Sony Xperia 1 Mark 5 photos
Phones

Sony Xperia 1 Mark 5 Picture Shows Major Changes

February 3, 2023
SUPERVOOC S Power Management Chip
Phones

With SUPERVOOC S Chip, OnePlus Ace2 becomes Triple-core Ace

February 3, 2023
AOET Set to Supply Lenses for iPad Starting 2023
Tablet

AOET Set to Supply Lenses for iPad Starting 2023 – The Full Story

February 3, 2023
Vivo X90 Confession Model
Phones

Fall in Love with Vivo X90 Confession Model This Valentine’s Day

February 3, 2023
Load More

Trending Now

  • Download Samsung Galaxy S23 Wallpapers in Advance
  • Official Hints Xiaomi's Next Big Thing Coming
  • Realme GT Neo5 Design Features Transparent Performance Structure and Racing-Inspired Elements
  • Honor 90 Series Bringing Key Upgrades Based on User Feedback
  • Snapdragon 8 Gen2 For Galaxy Has 3 Big Upgrades
  • Huawei P60 Pro Camera System Pack will Bring Next-Level Mobile Photography

Recent Posts

  • HONOR Magic 5 Clear Certification; New Lens to Compete with IMX989
  • Sony Xperia 1 Mark 5 Picture Shows Major Changes
  • With SUPERVOOC S Chip, OnePlus Ace2 becomes Triple-core Ace
  • AOET Set to Supply Lenses for iPad Starting 2023 – The Full Story
  • Fall in Love with Vivo X90 Confession Model This Valentine’s Day

Subscribe to Blog via Email

Enter your email address to subscribe to this blog and receive notifications of new posts by email.

Join 141 other subscribers
SPARROWS NEWS

Your number one source for all technology and smartphone news. Dedicated to giving you the very best gadget news focus on smartphone, gadgets and technology.

© 2020 SPARROWS NEWS

  • Home
  • Latest News
  • Upcoming Events
  • Videos
  • Category
  • Contact Us
  • Author

© 2020 SPARROWS NEWS

Go to mobile version