Samsung will Produce Snapdragon 875 using EUV Equipment; Got 1 Trillion Won Order

Samsung will Produce Snapdragon 875

Samsung will Produce Snapdragon 875 using EUV equipment

With less than 3 months to 2021, major handset makers are beginning preparations for their new flagships, and in the case of the Android camp, it will undoubtedly be laid out around the Snapdragon 875 platform.

Samsung will Produce Snapdragon 875

Samsung is also fighting hard to win Qualcomm’s Snapdragon 875 processor order. It was previously reported that Samsung’s 5nm process was having problems with yield, which led to Qualcomm having to request TSMC, but as things stand now, the former should have solved the problem.

According to industry insiders, Samsung Electronics has secured a 1 trillion won order to produce next-generation 5G high-end smartphone mobile application processors for Qualcomm. The Snapdragon 875, which will be releasing in December, is expected to be used in smartphones from Samsung, Xiaomi, and OPPO. This is the first time Samsung has received an order for Qualcomm’s flagship chips.

Samsung has reportedly started mass production of the Snapdragon 875 using EUV equipment on its production line in South Korea, which will take on TSMC’s 5nm foundry Apple A14 and Huawei Kirin 9000. In addition to the Snapdragon 875 processor, Samsung’s 5nm production line will reportedly also foundry the Snapdragon X60 modem as well as the Exynos 1000.

The Snapdragon 875’s specific specifications are not available for now, with the news that the codename sm8350 will introduce a truly massive core combination architecture. The Snapdragon 875 may introduce a combination of ARM Cortex-X1 supersized cores and Cortex-A78 large cores, with the newly designed X1 cores being 30% and 23% more energy efficient than the A77 and A78, respectively, and doubling the machine learning capability of the A78, which is expected to integrate 5G baseband on Qualcomm’s flagship platform for the first time, bidding farewell to plug-ins altogether.

Source, Via

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