Qualcomm Snapdragon 875G and 735G Exposure Built on 5nm EUV process And Integrated 5G

Qualcomm Snapdragon 875G

Qualcomm Snapdragon 875G and Snapdragon 735G

Qualcomm launched the Snapdragon 865 Plus chip this month, which is a small upgrade of the Snapdragon 865. The real major upgrade depends on the flagship chip of the Qualcomm Technology Summit in December.

In the morning news, the blogger shared an investment bank report that exposed Qualcomm and MediaTek’s future chip product planning, of which Qualcomm’s layout is the most eye-catching. The report indicated that Qualcomm’s Snapdragon 875G chip will use Samsung’s 5nm EUV process, and will be launched in the first quarter of 2021.

Qualcomm Snapdragon 875G and Snapdragon 735G Roadmap

As shown in the figure, Qualcomm seems to be launching a flagship chip named Snapdragon 875G, which has more suffix “G” than the previous name, will be listed in Q1 in 2021, using Samsung’s 5nm EUV process, but the authenticity remains to be seen verification.

According to the latest news, Samsung’s 5nm EUV process performance has been increased by 10% and power consumption has been reduced by 20%.

The news about Snapdragon 875G, combined with the rumors of Qualcomm’s next-generation flagship chip, shows that Qualcomm intends to use ARM’s latest Cortex-X1 super core and Cortex A78 large core combination to introduce a real super large on the 1+3+4 three-cluster architecture. nuclear.

According to ARM’s official introduction, Cortex-X1 improves performance by 30% compared to A77, 23% compared to A78, machine learning ability is improved by 100%, and allows customers to customize.

If Qualcomm adopts the combination of Cortex-X1+Cortex A78, it will inevitably improve the performance of Android phones again, and it is said that Qualcomm’s next-generation flagship chip will integrate 5G baseband, and power consumption and heat generation will be effectively controlled, which is worth looking forward to.

In addition to Qualcomm Snapdragon 875G, the figure also shows many other chips. For example, the Snapdragon 735G, which also uses Samsung’s 5nm EUV process, will be launched sometime between the first quarter and the second quarter of next year.

The Snapdragon 435G will be officially released in Q1 next year; also, Qualcomm will announce two low-end chips in the fourth quarter of this year Snapdragon 662 and Snapdragon 460; MediaTek will adopt the 7nm process of the Dimensity 600 chip soon, and Dimensity 400 with 6nm process is expected to debut in the fourth quarter of this year.

Some reports suggest that Qualcomm Snapdragon 875 and X60 5G baseband have been officially put into mass production at TSMC and are expected to be delivered in September.


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