Qualcomm And BOE Cooperate to develop 3D Ultrasonic Fingerprint Products

Qualcomm and BOE

Qualcomm And BOE Cooperation

Qualcomm will cooperate with BOE to develop display products that support 3D ultrasonic fingerprints.

Qualcomm China announced that it will cooperate with BOE, a global semiconductor display industry leader, to develop innovative display products integrating Qualcomm 3D Sonic ultrasonic fingerprint sensors.

Qualcomm 3D Ultrasonic Fingerprint illustration

This strategic cooperation will cover smartphones and 5G-related technologies, and is expected to expand into the fields of XR (extended reality) and the Internet of Things.

In addition, Qualcomm said that based on the cooperation between the two parties, OEM manufacturers can more easily design and develop cutting-edge products. Commercial terminals equipped with integrated solutions of BOE OLED flexible displays and Qualcomm 3D Sonic sensors are expected to be available in the second half of 2020.

Using sound waves to read a finger‘s valleys and ridges, 3D Sonic Sensor transmits an ultrasonic pulse against the finger. This creates a detailed 3D reproduction of the scanned fingerprint for quick and easy security performance.

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