Hisense F50 5G with T7510 5G chip
Earlier Hisense’s official weibo mobile phone brought a new machine preview, saying that Hisense F50 5G will be officially released on April 20th.
Regarding this phone, Hisense has already warmed up before. The most special place of this phone is that it will be equipped with Ziguang Zhanru’s Hu Ben T7510 5G chip. This 5G chip is powered by Ziguang Zhan Rui’s first 5G baseband chip Chun Teng V510 + Hu Ben.
The T710 chip is composed of Huben T710 with 8-core architecture, 4 × 2.0GHz A75 and 4 × 1.8GHz A55, equipped with 800MHz IMG PowerVR GM 9446 GPU, using heterogeneous dual-core architecture NPU, and also integrates 4K 30fps codec, 802.11AC, BT 5.0 and other multimedia capabilities and dual-band Wi-Fi, Bluetooth 5.0, etc.
In terms of appearance device is equipped with rear quad camera set-up, rear mounted fingerprint scanner and front water drop single face camera.
In addition, this phone has a built-in battery with a capacity of 5010mAh, which supports up to 18W fast charging and 8mm super-large PC-level heat pipe heat dissipation.
In fact, this phone has been released once in February, but the press conference did not announce its price information at that time.
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