Redmi K30 Pro Teardown
Redmi K30 Pro will be officially released on March 24, and the official Redmi K30 Pro teardown video released by Wang Teng Thomas in advance, and before it’s release. This 3 minutes and 21 seconds video completely unveiled internal design details of this new machine have also been exposed in advance. Let’s take a look.
Redmi K30 Pro teardown video released by Redmi product director Wang Teng Thomas also exposed the highly integrated “sandwich” motherboard structure used by the new machine this time.
The K30 Pro uses a pop-up full-screen and camera-centered design. The area where the internal motherboard can arrange components is greatly compressed, and only 66% of the motherboard area can arrange components.
The huge number of components of a 5G mobile phone is about 2.7 times that of a 4G mobile phone, which brings a second challenge to space layout.
To solve these problems, the K30 Pro uses an ultra-high integration design, with about 61 components arranged per 1cm square area. Not only that, but also adopts the “sandwich” structure, becoming another self-transcendence in the exploration of Redmi technology.