MediaTek Helio M70 5G Modem

MediaTek Helio M70 5G chip release: 7nm process, A77 CPU core

MediaTek Helio M70 5G Modem

At the Taipei Computer Show, MediaTek released a new 5G mobile platform. The multimode 5G system single-chip (SoC) is manufactured on a 7nm process and will support the first high-end 5G smartphones.

The new 5G mobile platform with built-in 5G modem Helio M70, MediaTek has reduced the size of the entire 5G chip. It includes ARM’s latest Cortex-A77 CPU, Mali-G77 GPU and MediaTek’s independent AI processing unit APU, which can fully meet the power and performance requirements of 5G, providing ultra-fast connection and ultimate user experience.

MediaTek Helio M70 5G Modem
MediaTek Helio M70 5G Modem

This multimode 5G mobile platform is suitable for 5G independent and non-independent (SA/NSA) networking architecture Sub-6GHz frequency band, and supports compatible connection technology from 2G to 4G.

MediaTek Helio M70 5G Modem
MediaTek Helio M70 5G Modem

The MediaTek 5G mobile platform integrates the 5G modem Helio M70 in an energy-saving package. This design is superior to the external 5G baseband chip solution, enabling higher transmission rates with lower power consumption and creating a comprehensive super for terminal handset manufacturers. High-speed 5G solution.

The MediaTek 5G mobile platform will deliver samples to major customers in the third quarter of 2019. The first 5G terminals equipped with the mobile platform will be available in the first quarter of 2020. The full technical specifications of MediaTek’s 5G chip will be released in the coming months, and its integrated 5G chip functions and technologies for the Sub-6GHz band include:

5G Modem Helio M70: This 5G chip integrates the MediaTek Helio M70 5G modem.

4.7 Gbps download speed and 2.5 Gbps upload speed

Intelligent energy saving features and comprehensive power management

Support multi-mode – support 2G, 3G, 4G, 5G connection, and dynamic power allocation to provide users with a seamless connection experience

New AI architecture: equipped with a new independent AI processing unit APU to support more advanced AI applications. Including image processing technology that eliminates image blur, even if the subject moves quickly, the user can still take a wonderful photo.

The latest CPU technology: MediaTek 5G chips are equipped with the latest ARM Cortex-A77 CPU, which has strong performance.

State -of-the- art GPUs: The latest ARM Mali-G77 GPUs deliver seamless seamless streaming and gaming experiences at 5G.

Innovative 7nm FinFET: 5G chip with advanced 7nm process, achieving significant energy savings in a very small package.

High-speed throughput: peak throughput reaches 4.7Gps download speed (Sub-6GHz band), supports new air interface (NR) two-component carrier (CC), supports non-independent (NSA) and independent (SA) 5G networking architecture.

Powerful multimedia and imaging performance: 4K video encoding/decoding for 60fps and ultra high resolution camera (80MP)

The Heidel 5G mobile platform integrated modem Helio M70 supports LTE and 5G dual connectivity (EN-DC), has dynamic power allocation, and supports cellular networks from 2G to 5G generations. It uses dynamic bandwidth switching technology to allocate the required 5G bandwidth for specific applications, thereby increasing modem power performance by 50% and extending the endurance of the terminal.

MediaTek has partnered with leading mobile operators, equipment manufacturers and suppliers to validate the pre-commerciality of its 5G technology in the mobile communications equipment market. MediaTek also works closely with 5G component suppliers and global operators in RF technology to quickly bring complete, standards-based, optimized 5G solutions to the market.

The latest 5G chip released by MediaTek is designed for the global Sub-6GHz band 5G network launched in Asia, North America and Europe.

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