Chip maker MediaTek participated in the Guangzhou China Mobile Global Partner Conference, showing its first 5G multi-touch integrated baseband chip Helio M70. This is also the first time the chip has appeared in the domestic market since its release in the middle of the year.
It is understood that MediaTek’s Helio M70 chip supports 2/3/4/5G network, supports 5G NR (new air interface), supports independent networking (SA) and non-independent networking (NSA), and supports Sub-6GHz frequency band. High-power terminals (HPUE) and other 5G key technologies, comply with the latest standard specifications of 3GPP Release 15, with 5 Gbps transmission rate, and support carrier aggregation.
In addition, the MediaTek Helio M70 baseband chipset not only supports LTE and 5G dual connectivity (EN-DC), but also ensures that mobile devices are backward compatible with 4G/3G/2G without a 5G network. According to MediaTek, the Helio M70 is able to design a 5G terminal device with a slim design advantage, helping manufacturers to design smaller, lower power mobile devices.
Recently, MediaTek has taken a lot of action on the chip. In addition to demonstrating 5G baseband chips, it is also preparing to release the Helio P90, a new generation of mid- to high-end mobile processors, on December 13. According to previous news, Helio P90 will build a second-generation APU, combined with the open architecture of the NeuroPilot AI 2.0 platform, to enhance the chip’s AI computing power.