According to the report, the chip will not be marketed as “Snapdragon 8150”, even though the chip is internally called “SM8150”, as initially supported by supporting evidence from internal sources and the Android code. According to our information, the chip is being manufactured for the first time in a 7-nanometer process at TSMC and will be available from next year in various high-end smartphones from manufacturers such as Samsung, LG, HTC, Motorola, Google and Sony. 5G support is provided by the Snapdragon X50 5G modem in addition to the integrated Snapdragon X24 LTE modem.
It is reported that the new chip will work with three CPU clusters, using four 1.78 gigahertz power-saving cores and three 2.42-GHz high-end cores. One of the four so-called “gold” cores will additionally achieve up to 2.84 GHz, which, as mentioned above, has not yet been confirmed by Qualcomm. The graphics unit used here will carry the name Adreno 640 according to our information and of course once again bring a performance increase. Qualcomm Snapdragon 855
